YXC金屬貼片HC-49SMD-32M-20pf石英無(wú)源晶振諧振器晶體廠家直銷(xiāo)
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訂貨量(單位)
¥0.39
≥10
店鋪主推品 熱銷(xiāo)潛力款
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廣東省深圳市
HC-49SMD 貼片2P | |||
請(qǐng)點(diǎn)擊您需要的參數(shù)一起加到購(gòu)物車(chē),找不到您需要的請(qǐng)聯(lián)系客服 | |||
標(biāo)準(zhǔn)頻率 | 負(fù)載電容 | 頻率偏差 | 點(diǎn)擊購(gòu)買(mǎi) |
3.6864MHZ | 20PF | 20PPM | rel="nofollow" Buy |
4MHZ | 20PF | 20PPM | rel="nofollow" Buy |
6MHZ | 20PF | 20PPM | rel="nofollow" Buy |
7.3728MHZ | 20PF | 20PPM | rel="nofollow" Buy |
8MHZ | 20PF | 20PPM | rel="nofollow" Buy |
10MHZ | 20PF | 20PPM | rel="nofollow" Buy |
11.0592MHZ | 20PF | 20PPM | rel="nofollow" Buy |
12MHZ | 20PF | 20PPM | rel="nofollow" Buy |
13.560MHZ | 20PF | 20PPM | rel="nofollow" Buy |
16.384MHZ | 20PF | 20PPM | rel="nofollow" Buy |
20MHZ | 20PF | 20PPM | rel="nofollow" Buy |
22.1184MHZ | 20PF | 20PPM | rel="nofollow" Buy |
24.576MHZ | 20PF | 20PPM | rel="nofollow" Buy |
24MHZ | 20PF | 20PPM | rel="nofollow" Buy |
25MHZ | 20PF | 20PPM | rel="nofollow" Buy |
26MHZ | 20PF | 20PPM | rel="nofollow" Buy |
27.120MHZ | 20PF | 20PPM | rel="nofollow" Buy |
27MHZ | 20PF | 20PPM | rel="nofollow" Buy |
28.6363MHZ | 20PF | 20PPM | rel="nofollow" Buy |
30MHZ | 20PF | 20PPM | rel="nofollow" Buy |
32MHZ | 20PF | 20PPM | rel="nofollow" Buy |
如您需要購(gòu)買(mǎi)同類(lèi)別的其他系列產(chǎn)品,請(qǐng)點(diǎn)擊以下鏈接 | ||
產(chǎn)品型號(hào) | 產(chǎn)品規(guī)格 | 點(diǎn)擊購(gòu)買(mǎi) |
HC-49US | 11.5x4.5x3.68mm | rel="nofollow" Buy |
HC-49SMD | 11.4x4.8x3.8mm | rel="nofollow" Buy |
HC-49UM | 11.05x4.65x13.46mm | rel="nofollow" Buy |
YSX321SL | 3225 4P | rel="nofollow" Buy |
YSX530GA | 5032 2P | rel="nofollow" Buy |
YSX531SL | 5032 4P | rel="nofollow" Buy |
YT-26 | 2060 2P | rel="nofollow" Buy |
YT-38 | 3080 2P | rel="nofollow" Buy |
R315 | D11,F11,TO39 | rel="nofollow" Buy |
R433 | D11,F11,TO39 | rel="nofollow" Buy |
石英晶振壓封條件
影響石英晶振平行封焊的因素還有夾具的設(shè)計(jì)、電極的位置、上蓋的質(zhì)量和上蓋與基座的匹配等,另外封焊設(shè)備本身的可靠性也是影響封焊質(zhì)量的因素之一。
夾具孔位的中心與轉(zhuǎn)臺(tái)中心要一致,夾具夾牢基座,否則焊接過(guò)程中電極可能會(huì)把基座粘起來(lái);左、右電極位置保持在同一高度和同一水平線上且盡量對(duì)稱(chēng);電極滾輪要定期打磨和更換、否則會(huì)影響焊接均勻性;上蓋尺寸不能太大或太小,而且拐角有傾角,因?yàn)殚L(zhǎng)方形基座的焊接電極與上蓋角接觸兩次,焊接熱量會(huì)影響焊接效果;采用邊緣有傾角的上蓋,焊接時(shí)錯(cuò)位的可能性會(huì)大大減小。
工藝參數(shù)的設(shè)定要根據(jù)各公司的現(xiàn)狀而定,只有優(yōu)化工藝參數(shù),才能提高石英晶振焊接質(zhì)量。在石英晶振封焊完產(chǎn)品后,對(duì)封裝過(guò)程中出現(xiàn)的現(xiàn)象進(jìn)行適當(dāng)?shù)目偨Y(jié),有待封裝技術(shù)的進(jìn)一步提高。
真空平行縫焊(真空度在無(wú)負(fù)載、無(wú)封焊動(dòng)作時(shí)可達(dá)1.1×10-3Pa),是在短邊封焊時(shí)加一道抽真空(真空度可達(dá)5×10-2Pa),后再封焊,其結(jié)果能大大的改善晶體的電阻指標(biāo)(可下降30~50%),適用于小尺寸、高指標(biāo)的產(chǎn)品。
平行封焊有半自動(dòng)機(jī),只完成上蓋點(diǎn)焊;滾焊密封由另一臺(tái)設(shè)備完成,中間銜接有人工搬運(yùn)。全自動(dòng)機(jī)是將真空烘烤、上蓋、點(diǎn)焊,滾焊密封、收納一機(jī)完成。